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X-MINING Low Temperature Sintering to Form Copper Electrodes Fine Copper Powder

Various issues in electrode forming

=Customer’s requirements =

“We need copper powder with good dispersion that can form thin copper electrode films and does not aggregate.”

“We need copper powder that can be sintered at low temperature to achieve electrical conductivity.”

“We need solutions to lower the sintering temperature based on the copper powder we are currently using.”

“We need copper powder that is resistant to oxidation even if exposed to the air.”

“We need copper powder that can be sintered at a low temperature of less than 300°C to substitute silver powder, but we do not want to use fine copper powder which oxidizes easily.”

It is expected that user needs for copper powder will be increasingly diverse due to energy saving and the spread of electric vehicles and so on.

Our proposals For achieving low-temperature sintering

Can’t we solve these problems by utilizing the features of our cupper powder?

Fine copper powder developed by Sumitomo Metal Mining has a finer and narrower particle size distribution than ordinary atomized copper powder.

In addition, it is characterized by its low-temperature sintering ability, which can be sintered at less than 300℃ Celsius. It enables you to sinter at lower temperature by mixing with other copper powder.
It also shows excellent oxidation resistance even in the atmosphere.

To achieve low-temperature sintering

Sintering is a process of fusing particles together into solid mass by heat or/and pressure without fully melting particles.
Sintering is accelerated at higher temperatures, and the rate of sintering densification varies depending on the particle material, size, shape and so on.
Recently, technological developments related to printed electronics have made it mandatory to reduce the temperature of the electrode formation process in response to the diversification of substrates and peripheral materials, so conductive materials that sinter at low processing temperatures are required.
Copper-based materials are expected to be promising candidates for such needs, but copper is easier to oxidize than silver.
This problem is more serious when copper power become finer in order to enhance low temperature sinterability.
Therefore, it is necessary to design the surface which dose not inhibit sintering and prevent oxidation.

Sumitomo Metal Mining's fine copper powder - UCP series

Our Fine Copper Powder, UCP series, has the strengths of low-temperature sintering and oxidation resistance.
In addition, UCP series is also characterized by its submicron size, which is classified as ultrafine powder.

Low temperature sinterability

This material has a finer and sharper particle size distribution than ordinary atomized copper powder, and is low-temperature sinterable material that cuts 210°C when used alone. It can be combined with other copper powders to lower the sintering temperature.

Oxidation resistance

Since the antioxidant coating and surface of copper powder are directly connected without the oxide layer, this copper powder is not easily oxidized even when exposed to air at room temperature.
Our copper powder is not only easy to handle, but also take advantage of robustness when it is used as conductive filler for paste of ink.

Fine Copper Powders(UCP series)

Changes in oxidization of UCP series in atmospheric conditions
Changes in oxidization of UCP series in atmospheric conditions

Application example –sintering additives-

By changing the mixing ratio of our fine copper powder, you could change sintering temperatures as you need.
Submicron-sized UCP series is classified as ultrafine powder, it has excellent oxidation resistance, Therefore, the start temperature of sintering is as low as 210℃, and it can also be used as a sintering additive material for other atomized copper powders of a larger particle size.

Sintering behavior of UCP-030N

The figure shows the volume change rate of our Fine Copper Powder UCP-030N duringheating in a reducing atmosphere.
Note: The sintering temperature depends on the sintering conditions, so please use this data as a reference.

Our fine copper powder begins sintering at a lower temperature than atomized copper powder in an inert or a reducing atmosphere.

The possibility of using our fine copper powder is infinite

In addition to low-temperature sintering and oxidation resistance, our fine copper powder has a sharp particle size distribution and is easy to handle even in the atmosphere.

Copper has low electrical resistance and excellent thermal conductivity, and can be expected to be applied to a wide range of electronic components.
In recent years, the antimicrobial properties of copper have also received much attention. Our Fine Copper Powder has a narrow particle size distribution and is easy to handle in the atmosphere.
The functions of “preventing” oxidation and the growth of bacteria can be applied to other fields as well.
We would like you to utilize our “Fine Copper Powder” in various fields, and realize your ideas together.

The possibility of using our fine copper powder is infinite

Copper has low electrical resistance and excellent thermal conductivity, and can be expected to be applied to a wide range of electronic components.
In recent years, the antimicrobial properties of copper have also received much attention. Our Fine Copper Powder has an narrow particle size distribution and is easy to handle in the atmosphere.
The functions of “preventing” oxidation and the growth of bacteria can be applied to other fields as well.
We would like you to consider to realize your imagination with our “Fine Copper Powder” in a variety of fields, not limited to electronic components?

Related Documents

  • Oxidation-resistant submicron copper powder

    Overview

    Oxidation-resistant submicron copper powder
    INDEX
    • Features
    • Product Characteristics
    • The relationship between the particle size of fine copper powder and sintering behavior
  • Oxidation Resistant Copper Powder

    UCP-030N

    Oxidation Resistant Copper Powder
    INDEX
    • Overview
    • Features
    • Characteristics
    • Others

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