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X-MINING Protecting Electronic Devices from Current Surges Thick Film Paste

To meet surge-proof requirements for resistors

“Surging” is a phenomenon in which a large wave occurs instantaneously in excess of the steady state.
This phenomenon caused by the current in the electric circuit is called “surge current”.

When electronic equipment is damaged by surge current caused by static electricity or lightning strikes, it can cause malfunctions and other problems.

The risk of surge current is increasing as electronic devices become smaller and the number of in-vehicle electronic devices increases. For this reason, resistors, which are one of the components of electronic devices, are strongly required to improve their surge-proof characteristics to maintain high reliability.

Resistors are especially required to be resistant to Electro-Static Discharge (ESD).

ESD resistance is measured by the amount of change in resistance value when the charge in a capacitor is discharged by a high-voltage power supply, and the lower the value, the higher the resistance.

Our proposals

Improving Surge resistance of Resistive Paste by High Dispersion

Thick-film resistive layers are manufactured by firing a resistive paste composed of conductive particles and insulating glass particles.
Thick-film resistive layers have a structure in which conductive particles are dispersed in a glass matrix, and conductive paths are formed by the conductive particles.

When ESD current concentrates in a specific conductive path, the insulation of the glass near the conductive path decreases and the resistance value of this results in a large change in resistance value.

 

Sumitomo Metal Mining’s surge proof resistive paste is designed by dispersing conductive particles and insulating glass particles to form a uniform conductive path even when ESD occurs.

The possibility is infinit

Sumitomo Metal Mining has a surge proof thick-film resistive paste that maintains high ESD-resistance.
This material is suitable for miniaturization and densification of electronic components and for installation in mobility. Furthermore, it is expected to be applied to a variety of applications based on this characteristic and your various ideas.

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