Prevent Oxidation of copper
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Excellent oxidation resistance
Excellent oxidation resistance in air despite fine copper powder.
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Excellent low-temperature sinterability
UCP-030N starts shrinking from a low temperature close to 210 degrees.
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Sharp particle size distribution
SMM's unique wet synthesis method, submicron powder with sharp distribution.
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Material Properties
Sumitomo Metal Mining's fine copper powders (UCP series) have a narrow particle size distribution derived from a unique wet process, and sintering begins at a significantly lower temperature than the melting point of copper through particle bonding. Furthermore, by a proprietary surface treatment, this copper powder is easy to handle and not easily change its sintering characteristics even in the atmosphere at room temperature up to 200°C. In recent years, there has been a demand for the development of copper powders that can sinter at temperatures suitable for components with low heat resistance, such as plastic substrates. Generally, reducing the sintering temperature can be achieved by refining the particle size; however, this also makes the copper powder easier to oxidation, harder to handle. Against this background, Sumitomo Metal Mining has developed fine copper powders with particle sizes of 100nm, 200nm, and 300nm, balancing ease of handling as a powder and low-temperature sintering properties using unique wet synthesis. By offering a wide range of fine particle sizes, we aim to accelerate development speed for our customers. Additionally, by leveraging the unique properties of fine particles, we realize performance improvements not only in the field of electronic materials, such as copper's antibacterial materials but also in other sectors.
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Related Documents
-
Oxidation-resistant submicron copper powder
Overview
INDEX- Features
- Product Characteristics
- The relationship between the particle size of fine copper powder and sintering behavior
-
Oxidation Resistant Copper Powder
UCP-030N
INDEX- Overview
- Features
- Characteristics
- Others
Product Lineup
Developed Product lineup | UCP-030N | UCP-020N | UCP-020N2 | UCP-010N |
---|---|---|---|---|
SEM Average particle size(μm) | 0.26 | 0.21 | 0.21 | 0.09 |
Specific surface area(m2/g) | 2.59 | 3.14 | 3.15 | 7.83 |
O(%) | 0.63 | 0.44 | 0.70 | 1.4 |
C(%) | 0.38 | 0.26 | 0.53 | 0.59 |
*The average SEM particle size and specific surface area values are representative.
Anticipated applications: conductive materials, electromagnetic shielding materials, conductive fillers, antibacterial materials.
Product photograph of fine copper powder
Use of Copper Powder
Fine copper powder can use as conductive fillers for paste, ink, and functional resin.
Specific applications using these materials include electrodes, conductive adhesives (bonding materials), via hole fillers, and printed electronics wiring materials.
In addition, it can be used as a catalyst. In recent years, application in antimicrobial materials is also getting attention.
Application Examples of Fine Copper Powder for Low Temperature Sintering
Electrode form by copper poses a variety of challenges, such as aggregation, lowering sintering temperature, , and maintaining quality such as oxidation resistance.
Our fine copper powder (UCP series) ,a finer and sharper particle size distribution than ordinary atomized copper powder produced by the atomization method, begins sintering at a lower temperature than atomized copper powder.
Our fine copper powder also can be used as a sintering additive to lower the sintering temperature in combination with other copper powders as well as independently.
Furthermore, our fine copper powder has excellent oxidation resistance despite its fine size, because of its special surface treatment, and will be possible to improve the stability and the dispersibility in an organic solvent or resin.
If you have some trouble with aggregation or dispersion of copper powder in the paste forming smooth and thin copper electrode films, we hope you will consider our fine copper powder as one of the solutions.
Use case about “Low Temperature Sintering to Form Copper Electrodes” are introduced here.
Frequently asked questions about Fine Copper Powders
What is the main application of copper powder (UCP-030N)?
Our UCP-030N fine copper powder has excellent oxidation resistance and low-temperature sintering properties, making it suitable for metal filler in conductive paste/ink and sintering paste for die attach applications. Copper powder is also used in powder metallurgy and antimicrobial applications.
Can it be used in combination with other copper powders?
Our UCP-030N fine-grained copper powder is a low-temperature sintered copper powder characterized by its uniform particle size. By combining it with other copper powders, it is possible to increase packing density, lower sintering temperatures, and improve other properties.
Does this copper powder have water repellency?
No. Our UCP-030N can be easily dispersed in polar solvents such as water.
Related Documents
-
Oxidation-resistant submicron copper powder
Overview
INDEX- Features
- Product Characteristics
- The relationship between the particle size of fine copper powder and sintering behavior
-
Oxidation Resistant Copper Powder
UCP-030N
INDEX- Overview
- Features
- Characteristics
- Others
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