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High purity product
We use gold (Au) with a purity of 4N (purity 99.99%) and more, which is refined in-house, as a raw material.
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Advanced rolling technology / High precision microprocessing
In addition to the hot rolling technology that can make a ultra-thin plate, fabricate ultra-narrow width shapes
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Excellent (bonding) wettability
Focusing on the "solderability (wettability) to the materials and excellent wettability even on thermally deteriorated substrates.
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Material Properties
AuSn (Gold-Tin) Solder is an alloy mainly composed of gold (Au) and tin (Sn) and is excellent in thermal conductivity and electrical resistance. It is used as a bonding material for electronic components such as quartz oscillators and optical communication devices where high reliability is required due to the high content of Au.
The melting point of AuSn (Gold-Tin) Solder is 280℃, which is a moderate temperature as high-temperature solder, and it can suppress the thermal effect on electronic components during bonding. We have developed AuSn (Gold-Tin) Solder (S-type) with much better wettability than conventional one, focusing on the "affinity to the parent material (wettability)" when used by customers. S-type exhibits excellent wettability even on thermally degraded plating substrates. This is due to our unique manufacturing method that reduces the thickness of the oxide film on the surface of the AuSn (Gold-Tin) Solder, which causes deterioration in wettability.
This effect is expected to improve the yield during step soldering and prevent the occurrence of voids.
Photo on the left: Wettability comparison on deteriorated substrate by heat treatment.
Substrate: Surface Au plating 0.2µm / underlayer Ni plating 2.0µm / Fe-Ni-Co alloy
Substrate heat treatment: 500℃, 10min in nitrogen atmosphere
*For more details on the relationship between oxide layer and wettability, please Download materials as below.
Related Documents
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AuSn(Gold-Tin) Solder
S-Type
INDEX- Thin Oxide Film
- Excellent wettability
AuSn(Gold-Tin) Solder Wettability Test
Products line-up of AuSn (Gold-Tin) Solder
Composition(wt%) | Material Characteristics | Product shape |
---|---|---|
Au-20Sn Au-22Sn |
Melting point 280℃ |
Frame・Washer Ribbon Ball Pellet |
Specific gravity Au-20Sn:14.52 Au-22Sn:14.17 |
Product photos of AuSn (Gold-Tin) Solder
Examples of Use
In addition to being used as sealing material and solder material for quartz oscillators, communication devices, and semiconductor lasers, it is also used as electrodes for LEDs and mounting solder for electronic components.
Frequently Asked Questions
What is the melting point of AuSn (Gold-Tin) Solder?
The melting point of AuSn (Gold-Tin) Solder is 280℃ for eutectic composition Au-20Sn, and for Au-22Sn the melting start temperature is 280℃ and the melting end temperature is 315℃.
What are the precautions for use?
Depending on the components you use, if you use Au metallized (plated) components, the Au on the surface of the components diffuses into AuSn when melted, increasing the Au concentration in AuSn, precipitating a phase with a high melting point, and inhibiting good wetting spread. Therefore, when using Au metallized components, consider this and Au-22wt%Sn is the recommended composition.
Can AuSn (Gold-Tin) Solder be made into a wire?
We are not currently manufacturing wires. We can provide ribbons with a width of 0.3mm and a thickness of 15µm.
Is AuSn (Gold-Tin) Solder lead-free?
Yes, AuSn (Gold-Tin) Solder is an alloy of Au and Sn and is an environmentally friendly lead-free solder material.
Does AuSn (Gold-Tin) Solder contain RoHS directive substances?
It does not contain them.
Related Documents
-
AuSn(Gold-Tin) Solder
S-Type
INDEX- Thin Oxide Film
- Excellent wettability
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