Bonding
Enhance
Excellent bonding and wettability
Advanced rolling technology / High precision micro processing
AuSn(Gold-Tin) Solder
In addition to the hot rolling technology that can make a ultra-thin plate, minimum thickness of 12μm, high-precision punching processing make it possible to fabricate ultra-narrow width shapes with an outer diameter of less than 1mm (minimum 0.8mm) and a minimum frame width of 50µm (in the case of frame-shaped products).
Functions
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