X-MINING AuSn (Gold-Tin) Solder

AuSn (Gold-Tin) Solder is an alloy mainly composed of gold (Au) and tin (Sn) and is excellent in thermal conductivity and electrical resistance. It is used as a bonding material for electronic components such as quartz oscillators and optical communication devices where high reliability is required due to the high content of Au. The melting point of AuSn (Gold-Tin) Solder is 280℃, which is a moderate temperature as high-temperature solder, and it can suppress the thermal effect on electronic components during bonding. We have developed AuSn (Gold-Tin) Solder (S-type) with much better wettability than conventional one, focusing on the "affinity to the parent material (wettability)" when used by customers. S-type exhibits excellent wettability even on thermally degraded plating substrates. This is due to our unique manufacturing method that reduces the thickness of the oxide film on the surface of the AuSn (Gold-Tin) Solder, which causes deterioration in wettability. This effect is expected to improve the yield during step soldering and prevent the occurrence of voids.
Photo on the left: Wettability comparison on deteriorated substrate by heat treatment. Substrate: Surface Au plating 0.2µm / underlayer Ni plating 2.0µm / Fe-Ni-Co alloy Substrate heat treatment: 500℃, 10min in nitrogen atmosphere *For more details on the relationship between oxide layer and wettability, please Download materials as below.