X-MINING 【R&D】 Copper Powder-Added Cu-Ni Complex Ink

[Product Development] Product Photo of Copper Powder-Added Cu-Ni Complex Ink

“Metal complex ink that forms the basis of Copper Powder-Added Cu-Ni Complex Ink”

Case Introduction of Copper Powder-Added Cu-Ni Complex Ink

Printed electronics, a technology that applies conductive ink to substrates to form circuit patterns, is expected to be a key technology in realizing an IoT society. The general electronic circuit formation technology (subtractive) involves removing (etching) unwanted parts from metal materials formed on the entire substrate, which poses challenges in material and energy consumption.
In contrast, printed electronics is an additive process that applies conductive ink only where needed and is expected to reduce usage, environmental impact, and production costs. Additionally, production efficiency can be enhanced using the Roll-to-Roll method, which feeds flexible substrates through devices. It enables the creation of thin, lightweight, and flexible electronic devices, making it applicable to a wide range of industries, including industrial uses such as solar cells, consumer electronics such as wearable devices, sensor devices, and aviation, automotive, healthcare, and home appliances with applications such as Radio Frequency Identification (RFID) tags.
Sumitomo Metal Mining’s dialogue content “”X-TALK”” invites guests from inside and outside the company to introduce them in a dialogue format. Please also see the article on the future prospects of printed electronics with a professor from the National Institute for Materials Science (NIMS), which has the core technology of this material.
X-TALK：The Future Prospect of Printed Electronics

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