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X-MINING 【R&D】 Thermal Grease

Silicone-based materials are currently the most commonly used thermal interface materials (TIMs) for power semiconductors and other products in terms of heat resistance.
However, silicon-based TIMs are known to pose a risk of contact failure due to siloxane released from silicone, and this has been an issue for device reliability.
We have developed a new non-silicone thermal paste with high heat resistance which was a weak point of conventional non-silicone based TIMs by applying the following original technologies. We are searching for needs as a highly reliable heat management material.

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Material Properties

■Heat resistance: High thermal conductivity filler in the paste and greatly improved heat resistance compared with conventional non-silicone products.
■Printability: The viscosity suitable for printing is maintained, and bleed-out has been successfully suppressed , despite the high filler content.

Article : Non-silicon Based High Heat-Resistant Thermal Grease(Thermal Paste) is here. Article : Heat Radiating Material(Heat Conducting Composite) is here. For more information on the characteristics of the samples, please use the registration form below to download the documents and contact us using the inquiry form.

Related Documents

  • Non-Silicone-Based Durable Thermal Grease

    R&D product

    Non-Silicone-Based Durable Thermal Grease
    INDEX
    • To keep printability with high thermal conductivity
    • Excellent durability in high temperature range
    • Other features

Product Lineup of Thermal Grease

Development Samples
Grade Examples #1 #2 #3 #4 #5
Features Prevention of oil and filler separation, along with low Bond Line Thickness (BLT). Prevention of oil and filler separation, and low bleed-out. Prevention of oil and filler separation, and low bleed-out. High thermal conductivity achieved alongside low BLT and low viscosity.
High thermal conductivity with pump-out control (please consult us regarding reducing viscosity).
Thermal Conductivity (W/mK) 1.1 1.1 3.0 4.7 8.1
Minimum Layer Thickness (μm) 6 17 30 25 42
Density (g/cm3) 2.7 1.9 2.4 2.4 4.7
Viscosity (Pa-s)* 115 88 88 104 630
Up to 150°C
TG Weight Change (%)
≦±0.2
Bleed Out***

*Measured at a shear rate of 10/s at 25°C.
**Tested by applying to glass and heating at 150°C for 1 hour.
***The new type maintains a minimal layer thickness while achieving both high thermal conductivity and low viscosity.

 

Frequently asked questions
about Thermal Grease

What are the advantages of silicone-free Thermal Grease?

No siloxane gas, which can cause contact failure gas and lens fogging, is generated.

What is the heat resistance temperature of Thermal Grease?

Our Thermal Grease achieves heat resistance of 150°C or higher, which is difficult to achieve with conventional non-silicone one.

In what applications is Thermal Grease used?

A common application of TIM products is heat dissipation, mainly in electronic devices. They are used in areas where heat generated by electrical resistance can be discharged, such as CPU cases in PCs and electronic devices in hybrid vehicles.

Related Documents

  • Non-Silicone-Based Durable Thermal Grease

    R&D product

    Non-Silicone-Based Durable Thermal Grease
    INDEX
    • To keep printability with high thermal conductivity
    • Excellent durability in high temperature range
    • Other features

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