X-MINING Non-silicon Based High Heat-Resistant Thermal Grease(Thermal Paste)

A key technology in thermal management is the efficient transfer of heat from heat-generating devices, including the efficient use of heat. TIM (Thermal interface material) is materials that efficiently transfers the heat generated to the heat fins.
In recent years, the increase in energy density of SIC power devices and the increase in the amount of processing in MPUs for 5G communications has led to increased heat generation and higher temperatures. Therefore, TIM must also have higher thermal reliability.

At present, silicon-based products are widely used for TIM applications because of their high heat resistance, but there are concerns about contact failures caused by free siloxane in silicon-based products. There is a need for high heat resistance non-silicon-based TIM applications. This is because contact failures can cause electronic equipment to malfunction.
TIM applications are a composite of inorganic thermally conductive filler and organic material. In order to efficiently transfer heat from the heat-generating device to the heat-dissipating device, both the flexibility to follow the thermal deformation of the heat-generating and heat-dissipating devices and the adhesion to fill the gap between the two devices are important. Polymers are able to maintain this flexibility and adhesion. However, common polymers could not reach the heat resistance of silicon.

We have developed a new non-silicon thermal grease(thermal paste) with high heat resistance by applying the following original technologies.
(1) High thermal conductivity filler in the paste
(2) Controlling printability with high fill and fluidity
(3) Solubilize the carbide-polymer generated by using organic matter with suppressed pyrolysis reactions.

As a result, the durability of our non-silicon products has increased by about 20 times compared to conventional products.
Please contact us for more details such as comparative data between non-silicon thermal grease(thermal paste) and conventional products.

The first non-silicone paste with improved heat resistance, high durability and easy to coating