Near-Infrared Absorbing Materials
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High reliability
Flat film-metal interface realizes precise patterning and high insulation reliability of FPC.
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Microfabrication
Thin and uniformed copper layer realizes precise patterning.
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Flexibility and toughness
Low spring-back and high folding endurance contribute to downsize electronic equipment.
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High transparency
High transparency of base film maintained and enables to be applied for various “transparent products”.
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Low transmission loss
Flat film-metal interface of FCCL realizes low transmission loss at high-frequency.
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small and light
FCCL with thin copper layer and thin film contributes to downsize electronic devices.
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Material Properties
Sumitomo Metal Mining's FCCL (2-layer FCCL and transparent FCCL) is material fabricated by forming copper layer onto various organic resin films, such as polyimide films or transparent films. Flat film-metal interface and thin, uniformed copper thickness enable to process fine-pitch FPC. Wanted thickness of copper layer can be selected from 0.1μm to 9μm, and suited for subtractive process or semi-additive process(SAP,MSAP). Especially for SAP or MSAP, thin polyimide film of 12.5µm can be applied to achieve thinner and higher integrated devices. SMM transparent FCCL maintains original transparency of base film after processing FPC. As base film for transparent FCCL, PET film, colorless polyimide film having heat resistance, COP(cyclo olefin polymer) film having high transparency and low transmission loss or other various films can be applied. They should be suitable to the application of transparent displays, transparent FPC, transparent antennas, and transparent heaters. FCCL applying resin film is expected to be a substitute for copper foil as thinner, lighter and more flexible material.
Related Documents
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Copper-clad laminate (2-layer FCCL, transparent FCCL)
S’PERFLEX
INDEX- Product Overview and Features:
- Advanced metallization technology
- Smooth film interface and thin, uniform copper thickness
- 2-layer FCCL combining organic resin film and freely adjustable copper layer thickness
- Product Lineup:
- Available in various film types, copper layers, and shapes
Product Lineup
You can select FCCL with various films and wanted thickness of copper lSingle-sided (copper/film)
Double-sided (copper/film/copper)ayer. Please contact us for detailed specifications.
| Film | Copper layer | Shape |
|---|---|---|
| Polyimide film Transparent films, etc. |
Single-sided (copper/film) Double-sided (copper/film/copper) Standard thickness 0.3 μm, 2 μm, 8 μm (available down to 0.1μm as option, please contact us) |
Roll type, (for width or length, please contact us) |
Major Application Examples of FCCL
SMM FCCL is mainly used as material to fabricate substrates for mounting driver IC in LCDs and organic EL displays, and are used in TVs, monitors, mobile PC, smart phones, and tablets. In future, they are expected to be used in electronic paper and monitors inside automobiles.
Transparent FCCL applying transparent films can be used for transparent displays and transparent FPC, transparent antennae, and transparent heaters.
Main usage of FCCL
FCCL can be used as materials for patterning various electric circuits.
The thickness of the copper layer can be selected to match processing method. For example, copper layer of 0.1μm to 4μm for semi-additive process (SAP,MSAP), 6μm to 8μm for subtractive process and 2μm to 5μm for subtractive process with panel-plated through-hole.
Transparent FCCL applying transparent films can be used to fabricate transparent FPC without impairing visibility.
SMM FCCL adopts Roll to Roll process to suit mass production.
SMM FCCL can be a substitute for copper foil in parts to be thinner, lighter and more flexible.
Frequently Asked Questions Regarding FCCL
How is FCCL used?
Used as a base material to form electric circuits for devices. For example, SMM FCCL has been used as a base-material to fabricate substrate for mounting a driver IC to control TVs, monitors, mobile PC, smart phones, and tablets displays.
What are the main features of FCCL?
One of the main features of SMM FCCL is flat film-metal interface. Flat interface can solve various problems. For example, if a fine circuit cannot be formed due to uneven shape of patterning, FCCL with flat interface can help to improve linearity in shape and uniformity in width. Further improvements expected as follows.
(Examples)
- improve high-precision patterning to ensure insulation reliability for long period.
- improve folding endurance to prolong the life of FPC for foldable devices.
- improve transmission speed with low signal loss at high-frequency.
- improve transparency of transparent FCCL not to impair visibility after patterning.
What is the difference between SMM FCCL and other materials?
SMM FCCL does not contain adhesive.
SMM FCCL is fabricated by forming copper layer directly on various organic resin films using advanced metallizing technology. You can select copper layers freely in thickness and film types to suit your requirements.
(Combination example)
- FCCL using thin film → Suitable for applications of FPC with low spring-back or substitute for copper foil.
- FCCL using transparent film → Suitable for transparent FPC applications
What is the usage of FCCL?
Used as materials to fabricate FPC with SAP,MSAP and subtractive processes. Transparent FCCL with thin copper layer can be used to form thin and narrow patterning not to impair visibility. Besides, FCCL can be a substitute of copper foil for lightweight and flexibility.
Related Documents
-
Copper-clad laminate (2-layer FCCL, transparent FCCL)
S’PERFLEX
INDEX- Product Overview and Features:
- Advanced metallization technology
- Smooth film interface and thin, uniform copper thickness
- 2-layer FCCL combining organic resin film and freely adjustable copper layer thickness
- Product Lineup:
- Available in various film types, copper layers, and shapes
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