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X-MINING Documents List

Near-Infrared Absorbing Materials

  • Optical Data Sheet

    YMF-02A

    Optical Data Sheet
    INDEX
    • Optical measurement procedure
    • Optical properties
  • Optical Data Sheet

    YMDS-874

    Optical Data Sheet
    INDEX
    • Optical measurement procedure
    • Optical properties
  • Optical Data Sheet

    KHF-7AH

    Optical Data Sheet
    INDEX
    • Optical measurement procedure
    • Optical properties

Thick Film Pastes

  • Copper-Paste For Circuit-Forming

    KG-2438

    Copper-Paste For Circuit-Forming
    INDEX
    • Features
    • Typical Product Specifications
    • Recommended Process Conditions
    • Characteristics

Magnetic Materials

  • Wellmax™

    Bonded Magnet Materials of SMM

    Wellmax™
    INDEX
    • Features of Wellmax™
    • Higher rust resistance than NdFeB magnets
    • Reduction of Weight and Cost with Wellmax™
    • Make differentiations throught injection molding
    • Application examples of Wellmax™
  • Wellmax™-S1

    Anisotropic SmFeN (Samarium-Iron-Nitrogen) magnet powder

    Wellmax™-S1
    INDEX
    • Composition
    • Particle size distribution and SEM appearance
    • Magnetic properties and demagnetization curve
  • Wellmax™-S3 Series

    Anisotoripic SmFeN (Samarium-Iron-Nitrogen) PA12 magnet pellet for injection molding

    Wellmax™-S3 Series
    INDEX
    • Magnetic, mechanical and thermal properties
    • Demagnetization curves(with temperature dependence)
    • Magnetizing, Alignment and demagnetizing properties
    • Stability(at 80℃90%RH、120℃Dry)
    • Recomended molding conditions
  • Wellmax™-S4 Series

    Anisotropic SmFeN (Samarium-Iron-Nitrogen) mixed Ferrite PA12 magnet pellet for injection molding

    Wellmax™-S4 Series
    INDEX
    • Magnetic, mechanical and thermal properties
    • Demagnetization curves(with temperature dependence)
    • Magnetizing, Alignment and demagnetizing properties
    • Stability(at 80℃Dry)
    • Recomended molding conditions
  • Wellmax™-S5B Series

    Anisotropic NdFeB mixed SmFeN PA magnet pellet for injection molding

    Wellmax™-S5B Series
    INDEX
    • Magnetic, mechanical and thermal properties
    • Demagnetization curves(with temperature dependence)
    • Magnetizing, Alignment and demagnetizing properties
    • Stability(at 80℃ and 120℃Dry)
    • Recomended molding conditions
  • Wellmax™-S5P Series

    Anisotropic NdFeB mixed SmFeN PPS magnet pellet for injection molding

    Wellmax™-S5P Series
    INDEX
    • Magnetic, mechanical and thermal properties
    • Demagnetization curves(with temperature dependence)
    • Magnetizing, Alignment and demagnetizing properties
    • Stability(at 80℃ and 150℃Dry)
    • Recomended molding conditions

Fine Copper Powders

  • Oxidation-resistant submicron copper powder

    Overview

    Oxidation-resistant submicron copper powder
    INDEX
    • Features
    • Product Characteristics
    • The relationship between the particle size of fine copper powder and sintering behavior
  • Oxidation Resistant Copper Powder

    UCP-030N

    Oxidation Resistant Copper Powder
    INDEX
    • Overview
    • Features
    • Characteristics
    • Others

Copper Powder-Added Cu-Ni Complex Ink

  • Copper hybrid ink

    For conductive material as Printed Electronics

    Copper hybrid ink
    INDEX
    • Advantage
    • Circuit forming process
    • Evaluation for Oxidation-resistant
    • Application

Fe-Ga Alloy Single Crystal

  • Fe-Ga Alloy Single Crystal

    R&D product

    Fe-Ga Alloy Single Crystal
    INDEX
    • Feature of Fe-Ga alloy single crystals

Thermal Grease

  • Non-Silicone-Based Durable Thermal Grease

    R&D product

    Non-Silicone-Based Durable Thermal Grease
    INDEX
    • To keep printability with high thermal conductivity
    • Excellent durability in high temperature range
    • Other features

[Wet-chemical synthesized metal powder] Ultra-fine nickel powders

  • Ultra-fine nickel powders

    MIT-60, MIT-100

    Ultra-fine nickel powders
    INDEX
    • Features
    • Uniform particle size distribution generated by wet synthesis method
    • Spherical particles with minimal surface irregularities
    • Characteristics
    • Particle size distribution of nickel powder
    • Sinterability of nickel powder (measured by TMA)

AuSn (Gold-Tin) Solder

  • AuSn(Gold-Tin) Solder

    S-Type

    AuSn(Gold-Tin) Solder
    INDEX
    • Thin Oxide Film
    • Excellent wettability

Copper-clad laminate (2-layer FCCL, transparent FCCL)

  • Copper-clad laminate (2-layer FCCL, transparent FCCL)

    S’PERFLEX

    Copper-clad laminate (2-layer FCCL, transparent FCCL)
    INDEX
    • Product Overview and Features:
    • Advanced metallization technology
    • Smooth film interface and thin, uniform copper thickness
    • 2-layer FCCL combining organic resin film and freely adjustable copper layer thickness
    • Product Lineup:
    • Available in various film types, copper layers, and shapes