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Excellent low-temperature sinterability to start sintering from 210℃.
UCP series start shrinking from a low temperature close to 210 degrees in a 2% hydrogen atmosphere.
Furthermore, no expansion is observed in the high-temperature range, which is seen in general wet method products.
With these charateristics, it can also be used as a sintering additive for copper powder.
Low-Temperature Sintering
Allows for circuit formation at temperatures that flexible substrates like polyimide can withstand, achieving particularly high printing adhesion.
UCP-030N
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